| Epoxy Resin Technical Specifications | Kev ntim khoom | Daim ntawv thov | |||||||||||||
| Qauv | Xim | Daim ntawv | Cov ntsiab lus (%) | EEW (g/eq) | Softening Point (℃) | Chromaticity (G / H) | viscosity (mPa·s) | Hydrolyzable Chlorine (ppm) | Bromine Cov ntsiab lus (%) | Cov ntsiab lus phosphorus (%) | Qauv | ||||
| Bisphenol F Epoxy Resin | Txheem bisphenol F hom Epoxy resin tov | TIAB SA 160 | Colorless rau Lub teeb daj | Ua kua | - | 155-165 : kuv | - | H≤20 | 1200-1600 Nws | ≤150 | - | Hlau nruas: 240kg / nruas IBC pob: 1000kg ISO tank pob: 22tons | Cov txheej txheem tsis muaj kuab lom, castings, adhesives, rwb thaiv tsev cov ntaub ntawv thiab lwm yam. | ||
| TIAB SA 170 | Tsis muaj xim | 165-175 : kuv | G≤1 | 3500-4500 Nws | ≤100 |  | |||||||||
| Hloov kho bisphenol F hom Epoxy resin tov | EMTE 207k70 ua | Lub teeb daj rau Reddish xim av | 70 ± 1.0 | 500-600 | G;8 | 3000 | 500 | - | Galvanized hlau nruas ntim: 220Kg. | Printed circuit boards, hluav taws xob tooj liab clad laminates, adhesives, composite cov ntaub ntawv, hluav taws xob laminates thiab lwm yam khoom cheeb tsam. | |||||
