| Intermediates & Tshwj xeeb Resin Technical Specifications | ||||||||||||||||
| Qeb | Qauv | Xim | Daim ntawv | HEW (g/eq) | Melting Point (℃) | Softening Point (℃) | Chromaticity (G / H) | Cone-Plate Viscosity (P) | Phenol dawb (ppm) | Purity (%) | Qauv | Kev ntim khoom | Daim ntawv thov | |||
| Cov neeg nruab nrab | Phenolic resin | Bisphenol A Phenolic resin | TIAB SA 322 | Xim tsis muaj xim rau daj ntseg daj-xim av | Khoom | - | - | 114-119 : kuv | G≤0.8 | 60-90 | ≤2000 | - |  | Lub hnab ntawv nrog PE liner: 25 kg / hnab. | Epoxy resin intermediates los yog curing agents yog dav siv nyob rau hauv hluav taws xob tooj liab clad laminates, semiconductor ntim thiab lwm yam teb. | |
| Puag Phenolic resin | PF-2123 | Lub teeb daj rau Reddish xim av | 100-105 : kuv | G: 12-14 | - | ≤ 4 |  | Lub hnab ntawv nrog PE liner: 25 kg / hnab. Ton hnab: 500kg / hnab | Braking cov ntaub ntawv thiab cov ntaub ntawv sib txhuam xws li nres nres rau tsheb ciav hlau, tsheb thiab maus taus, bakelite hmoov rau cov khoom siv hluav taws xob, cov nplaum rau cov qij, cov log sib tsoo thiab cov roj hmab hnav-tiv taus rau kev sib tsoo thiab txiav, molding xuab zeb adhesives, nplaim retardant cov ntaub ntawv, thiab lwm yam. | |||||||
| Ortho-Cresol Phenolic resin | TIAB SA 210 | Lub teeb daj | 113-115 : kuv | G≤3 | 35-45 : kuv | 1000 | - | Lub hnab ntawv nrog PE liner: 25 kg / hnab. | Epoxy resin intermediates los yog curing agents yog dav siv nyob rau hauv hluav taws xob tooj liab clad laminates, semiconductor ntim thiab lwm yam teb. | |||||||
| TPN Tetraphenolethane Phenolic resin | TIAB SA 110 | Xim av | 90-110 : kuv | 135-145 : kuv | G≤18 | - | ≤1000 | - | Epoxy resin intermediate los yog curing agent. | |||||||
| Bisphenol F | TIAB SA 120 | Dawb rau Reddish Brown | - | ≥105 | - | G 0.8 | 1000 | ≥88 | - | Intermediates xws li low-viscosity epoxy resins, polycarbonate resins, polyphenylene ether resins thiab unsaturated polyesters, thiab tseem tuaj yeem siv los ua cov nplaim hluav taws, cov tshuaj tua kab mob thiab cov yas yas. | ||||||
| DCPD Phenolic resin | EMTP 100 | Liab xim av | 150-210 : kuv | - | 100-110 : kuv | G≤13 | ≤1000 | - | - | Hluav taws xob tooj liab clad laminate thiab lwm yam teb. | ||||||
| EMTD8700 Phosphazene nplaim Retardant Technical Specifications | ||||||||||||||||
| Qeb | Qauv | Xim | Daim ntawv | Melting Point (℃) | Cov ntsiab lus tsis haum (%) | Td5% (℃) | Cov ntsiab lus phosphorus (%) | Nitrogen ntsiab lus (%) | Qauv | Kev ntim khoom | Daim ntawv thov | |||||
| Phosphazene Nplaim Retardant | TIAB SA 8700 | Lub Ntiaj Teb Dawb rau Pale Daj | Khoom Hmoov | 104-116 : kuv | ≤0.5 | ≥330 | ≥13 | ≥6 | - | Lub hnab ntawv nrog PE liner: 25 kg / hnab. | Copper clad laminates, hluav taws xob potting kua nplaum, kev ua haujlwm txheej, nplaim hluav taws kub retardant plastics thiab lwm yam lag luam. | |||||
| Bismaleimide Technical Specifications | ||||||||||||||||
| Qeb | Qauv | Xim | Daim ntawv | Melting Point (℃) | Acid nqi (mgKOH/g) | Solubility | Qauv | Kev ntim khoom | Daim ntawv thov | |||||||
| Bismaleimide | Electronic Qib | TIAB SA 505 | Pleev daj | Khoom Hmoov | ≥155 | ≤1 | Soluble tag nrho | - | Zaj duab xis lined composite kraft ntawv hnab lossis ntawv ntim ntim 25kg ib lub hnab / thoob. | Aerospace structural cov ntaub ntawv, carbon fiber ntau kub resistant yam ntxwv qhov chaw, kub resistant impregnation xim, laminates, tooj liab clad laminates, molded yas, high-qib luam Circuit Court boards, hnav-resistant cov ntaub ntawv, pob zeb diamond sib tsoo log adhesives, sib nqus cov ntaub ntawv, castings thiab lwm yam khoom siv thiab lwm yam high-tech teb. | ||||||
| Hluav taws xob qib | d929 ua | Pleev Yellow-White | ≥155 | ≤1 | Soluble tag nrho | - | ||||||||||
